The **ATS-06F-172-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for thermal management in electronic systems. --- ### ## Technical Specifications Below is a breakdown of the physical and thermal properties of this component: | Specification | Details | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00 mm x 30.00 mm x 25.00 mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance (Unducted)** | 5.94 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.88 °C/W @ 100 LFM | | **Pitch** | Fine-Pitch | | **Pattern** | XC-Cut | --- ### ## Key Electronic Components & Features #### 1. Heat Sink Geometry (XC-Cut) The "XC-Cut" refers to a cross-cut straight fin design. This is crucial for electronics because: * **Multidirectional Airflow:** Unlike standard straight fins, cross-cut fins allow air to enter from multiple angles, which is ideal for crowded PCBs where airflow direction might be unpredictable. * **Surface Area:** The fine-pitch design maximizes the surface area available for heat dissipation relative to the small 30x30mm footprint. #### 2. Attachment Mechanism (pushPIN™) The part uses a specialized mechanical attachment rather than thermal adhesive: * **Spring-Loaded Pins:** These provide consistent pressure (clamping force) across the surface of the processor or component, ensuring a reliable thermal interface. * **Reliability:** Mechanical fasteners are preferred in high-vibration environments (like industrial or automotive electronics) where adhesive might fail. #### 3. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with **T412 TIM** or a similar pre-applied phase-change material. * **Purpose:** It fills microscopic air gaps between the heat sink base and the electronic component (CPU, GPU, or MOSFET) to improve heat transfer. --- ### ## Common Applications This specific size and thermal profile are commonly used for: * **Processors/SoCs:** Small form-factor CPUs or ARM-based processors. * **Power Electronics:** Voltage regulators and high-power MOSFETs. * **Telecommunications:** Network switches and routers where board space is limited.