ATS-06F-173-C3-R0
AI

The **ATS-06F-173-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, and power modules.
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### 1. Technical Specifications
The following table summarizes the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin (Brass) |
| **Fin Style** | Straight |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm |
| **Thermal Resistance** | 4.91°C/W @ 100 LFM |
| **Thermal Interface (TIM)** | T766 (Pre-applied) |
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### 2. Key Component Features
#### A. Fin Design
The "06F" series utilizes high-density straight fins. This design maximizes surface area for heat dissipation. Because the height is 30mm (relatively tall for its footprint), it is highly effective in systems with forced-air cooling (fans).
#### B. Push-Pin Attachment
Instead of using adhesive tape or screws, this part uses a **Brass Push-Pin** mechanism with a compression spring.
- **Benefit:** It provides consistent pressure across the chip surface, improving thermal transfer.
- **Requirement:** The PCB must have pre-drilled holes to accommodate the pins.
#### C. Thermal Interface Material (TIM)
The "C3" suffix indicates that the unit comes with **T766 phase-change material** pre-applied to the base. This eliminates the need for manual application of thermal paste and ensures a low-resistance path between the component and the heat sink.
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### 3. Thermal Performance Profile
Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Natural/Low) | 4.91 |
| 300 (Moderate) | 2.13 |
| 500 (High) | 1.62 |
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variations:
- **ATS**: Advanced Thermal Solutions.
- **06**: Series identifier.
- **F**: Fin style/configuration.
- **173**: Specific dimensions/geometry code.
- **C3**: Thermal Interface Material type (T766).
- **R0**: Revision/Packaging code.
- ⤷
What are the PCB hole diameter requirements for the brass push-pins used in this heat sink?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?
- ⤷ Is there a low-profile version of the 173 series for space-constrained applications?