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  • ATS-06F-173-C3-R0

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    The **ATS-06F-173-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Fin Style** | Straight | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm | | **Thermal Resistance** | 4.91°C/W @ 100 LFM | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Fin Design The "06F" series utilizes high-density straight fins. This design maximizes surface area for heat dissipation. Because the height is 30mm (relatively tall for its footprint), it is highly effective in systems with forced-air cooling (fans). #### B. Push-Pin Attachment Instead of using adhesive tape or screws, this part uses a **Brass Push-Pin** mechanism with a compression spring. - **Benefit:** It provides consistent pressure across the chip surface, improving thermal transfer. - **Requirement:** The PCB must have pre-drilled holes to accommodate the pins. #### C. Thermal Interface Material (TIM) The "C3" suffix indicates that the unit comes with **T766 phase-change material** pre-applied to the base. This eliminates the need for manual application of thermal paste and ensures a low-resistance path between the component and the heat sink. --- ### 3. Thermal Performance Profile Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 4.91 | | 300 (Moderate) | 2.13 | | 500 (High) | 1.62 | --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variations: - **ATS**: Advanced Thermal Solutions. - **06**: Series identifier. - **F**: Fin style/configuration. - **173**: Specific dimensions/geometry code. - **C3**: Thermal Interface Material type (T766). - **R0**: Revision/Packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the brass push-pins used in this heat sink?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ Is there a low-profile version of the 173 series for space-constrained applications?