The **ATS-06F-199-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Property | Description / Value | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Thermal Resistance** | 15.91°C/W (at 100 LFM) to 6.91°C/W (at 700 LFM) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 6.00mm | | **Fin Style** | Straight Fin | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body The body is made of **Aluminum**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** coating is not just for aesthetics; it provides surface protection against corrosion and increases the emissivity of the surface, slightly improving radiative cooling. #### B. pushPIN™ Attachment Mechanism Unlike traditional adhesive tapes or clips, this part uses the **pushPIN™** system: - **Flexible Spring:** Ensures consistent pressure (clamping force) against the component for optimal heat transfer. - **Easy Installation:** Pre-drilled holes allow for quick mounting to the PCB without complex tools. #### C. Thermal Interface Material (TIM) The "R0" suffix usually denotes that the part comes with **no pre-applied thermal interface material**, or it uses a specific standard pad. Users typically apply their own high-performance thermal paste or pad to fill the microscopic air gaps between the component and the heat sink base. --- ### 3. Application Use Cases This specific model is a "Low Profile" heat sink (only 6mm high), making it ideal for: * **1U Rack Servers:** Where vertical space is extremely limited. * **Embedded Systems:** Industrial PCs with tight enclosures. * **Telecommunications:** High-density line cards. --- ### 4. Thermal Performance Comparison (LFM) Airflow (Linear Feet per Minute) significantly impacts the cooling efficiency of this part: ```markdown LFM (Velocity) | Thermal Resistance (°C/W) ---------------|------------------------- 100 | 15.91 300 | 8.35 500 | 6.91 700 | 5.82 ```