The **ATS-06F-200-C3-R0** is a high-performance electronic thermal management component, specifically an aluminum heat sink designed for cooling integrated circuits (ICs) and other electronic packages. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 5.00mm | | **Fin Type** | Fine Pitch (Cross-cut) | | **Thermal Resistance** | 9.90°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Design Features * **Low Profile:** Standing at only **5mm high**, this heat sink is designed for height-constrained environments such as 1U servers, laptops, or compact embedded systems. * **Fin Pattern:** It uses a cross-cut pattern which allows for multi-directional airflow. This makes it efficient even if the airflow direction in the chassis is not perfectly aligned with the heat sink. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** phase-change material pre-applied to the base, ensuring optimal heat transfer from the chip to the aluminum. --- ### 3. Electronic Application This part is used to protect sensitive electronic components from **thermal throttling** or permanent damage. Common applications include: 1. **CPUs/GPUs:** Cooling low-power processors or mobile chipsets. 2. **FPGAs/ASICs:** Managing heat in high-speed logic devices. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Part Number Breakdown ```text ATS - 06 - F - 200 - C3 - R0 | | | | | | | | | | | └─ Revision Code | | | | └────── Thermal Performance/Color (Blue Anodized) | | | └──────────── Product Width/Size Reference | | └───────────────── Fin Style (Fine Pitch) | └────────────────────── Series Number └──────────────────────────── Manufacturer (Advanced Thermal Solutions) ```