The **ATS-06F-201-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, ASICs, and GPUs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Heat Sink Type** | Push Pin (Spring Loaded) | | **Dimensions** | 50mm x 50mm x 12mm | | **Fin Pattern** | Straight Fin | | **Thermal Resistance** | 8.17°C/W (at 100 LFM) | | **Attachment Method** | Push Pins with Brass Springs | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Model Name Electronic components often use "smart" part numbers. Here is the breakdown for this specific model: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **06**: Fin pitch/style category. * **F**: Fin geometry (Flat/Straight). * **201**: Specific dimensions and hole pattern code. * **C2**: Color and Finish (Blue Anodized). * **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Functions While the heat sink itself is a passive mechanical part, its role in an electronic circuit is critical: 1. **Thermal Management**: It increases the surface area of a hot component (like an FPGA), allowing heat to dissipate into the surrounding air via convection. 2. **Mechanical Attachment**: The use of **Push Pins** ensures consistent pressure between the heat sink and the chip. This prevents air gaps that would otherwise act as insulators. 3. **EMI Shielding**: To a minor extent, grounded aluminum heat sinks can help reduce electromagnetic interference (EMI) from high-speed processors. 4. **Interface Integrity**: The pre-applied **T766 thermal grease** ensures maximum heat transfer efficiency without the user needing to apply external paste. --- ### 4. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute - LFM) inside the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural Convection) | 8.17 | | 200 | 4.48 | | 300 | 3.24 | | 400 | 2.60 | ---