The **ATS-06F-210-C1-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). This specific part belongs to the **pushPIN™** family, designed for efficient thermal management in electronic systems. ### 1. Technical Specifications The following table summarizes the core technical attributes of the component: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 5.17°C/W (Unducted Flow @ 100 LFM) | | **Base Dimensions** | 70mm x 70mm | | **Height** | 25mm | --- ### 2. Key Features and Design The part is engineered for versatility and high thermal dissipation in tight spaces: * **Finned Design:** It features a "Fine Pitch" or "Straight Fin" design. This maximizes surface area while maintaining low pressure drop across the heat sink, making it ideal for systems with high-speed airflow. * **pushPIN™ Attachment:** The mechanism uses a spring-loaded push-pin system. This ensures even pressure across the surface of the component (like a CPU or FPGA) to maximize heat transfer through the Thermal Interface Material (TIM). * **Pre-Applied TIM:** These units typically come with a pre-applied high-performance **Thermal Interface Material**, simplifying the assembly process in a production environment. * **Durability:** The Blue Anodized finish provides corrosion resistance and increased emissivity for radiation cooling. --- ### 3. Application Use Cases This heat sink is commonly found in the following electronic environments: * **Networking Equipment:** Routers, switches, and high-speed hubs. * **Embedded Systems:** Industrial PCs and single-board computers. * **Telecommunications:** Cooling of power amplifiers or digital signal processors. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.17 | | 300 (1.5 m/s) | 2.51 | | 500 (2.5 m/s) | 1.79 | | 700 (3.5 m/s) | 1.48 | ---