The **ATS-06F-29-C1-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series of high-performance heat sinks. Below is a detailed breakdown of its specifications and electronic application properties. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-06F-29-C1-R0 | | **Type** | Heat Sink (Thermal Management) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 7.56°C/W (at 200 LFM) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm x 20mm | | **Fin Style** | maxiFLOW (Tapered Fin) | --- ### 2. Key Design Elements #### A. The maxiFLOW™ Fin Pattern The "F" in the part number indicates the maxiFLOW fin design. Unlike standard rectangular fins, these are tapered and spread outward. This design: * Reduces pressure drop. * Increases the surface area available for convection. * Maximizes airflow through the heat sink in constrained spaces. #### B. pushPIN™ Attachment System This part uses a specific hardware mounting system: * **Component:** Includes a flexible spring and a plastic/brass pin. * **Benefit:** Provides a consistent, pre-determined pressure (clamping force) on the electronic chip, ensuring optimal thermal contact with the Thermal Interface Material (TIM). #### C. Material and Coating * **Aluminum 6063:** Provides a balance of lightweight construction and high thermal conductivity. * **Blue Anodized Finish:** Not only provides aesthetic value but also increases corrosion resistance and slightly improves radiative heat transfer. --- ### 3. Electronic Application This part is typically used for cooling mid-range integrated circuits (ICs) such as: 1. **Processors (CPUs/GPUs):** Low-power embedded processors. 2. **FPGAs:** Field Programmable Gate Arrays used in telecommunications. 3. **ASICs:** Application-Specific Integrated Circuits in networking gear. --- ### 4. Thermal Performance (Deg C/W) Thermal resistance varies based on the airflow (Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 7.56 | | 400 | 2.0 | 3.06 | | 600 | 3.0 | 2.22 |