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  • ATS-06F-32-C1-R0

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    The **ATS-06F-32-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Fine-Pitch (Cross-Cut) | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height** | 12.70 mm | | **Pitch (Hole-to-Hole)** | 47.00 mm | | **Thermal Resistance** | 9.21°C/W (at 100 LFM) | --- ### 2. Key Electronic & Mechanical Parts #### A. The Heat Sink Body * **Material:** Made from **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. * **Geometry:** The "Fine-Pitch" design features a high density of fins, increasing the surface area for heat dissipation without significantly increasing the footprint. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** phase-change material pre-applied, which fills microscopic air gaps between the heat sink and the electronic chip. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a mechanical fastening system: * **Push Pins:** Made of brass or plastic, these insert through pre-drilled holes in the PCB. * **Compression Springs:** These provide a calculated "downward force" (pressure), ensuring optimal contact between the heat sink and the component for maximum heat transfer. --- ### 3. Part Number Decoder The part number **ATS-06F-32-C1-R0** can be broken down as follows: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **06** | Series number | | **F** | Fin style (Fine-pitch) | | **32** | Specific dimension/configuration code | | **C1** | Thermal Interface Material (TIM) type | | **R0** | RoHS compliant / Revision code | --- ### 4. Implementation Use-Case In an electronic circuit, the ATS-06F-32-C1-R0 is placed directly on top of a heat-generating component. As electricity flows through the IC, it generates heat; this heat is conducted through the TIM into the aluminum fins, where airflow (either natural or from a fan) carries the heat away, preventing thermal throttling or component failure.
    ✨ Follow-up Questions
    • ⤷What is the difference between the C1 and C2 versions of this heat sink?
    • ⤷ How do I calculate the required LFM for this specific thermal resistance?
    • ⤷ Are there plastic versus brass pin options for the pushPIN system?