The **ATS-06F-37-C3-R0** is a high-performance thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 9.10°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 22.86mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ## Key Components & Features ### 1. The Heat Sink Body * **Material:** Constructed from high-grade aluminum for a balance between weight and thermal conductivity. * **Fin Design:** It uses a **straight-fin** pattern which is optimized for airflow directed across the board. * **Anodization:** The blue anodized finish provides corrosion resistance and improves thermal radiation properties. ### 2. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, the "Push-Pin" system uses: * **Brass/Plastic Pins:** Two or more pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These provide precise, consistent pressure against the component, ensuring maximum thermal contact while preventing board warping. ### 3. Thermal Interface Material (TIM) The part number suffix **"C3"** indicates the thermal performance grade, and it comes with **T412** pre-applied. * This material fills microscopic air gaps between the component and the heat sink. * It is "Phase Change" or high-conductivity grease designed for high-reliability environments. --- ## Performance Metrics | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | 100 LFM (0.5 m/s) | 9.10 | | 200 LFM (1.0 m/s) | 3.80 | | 400 LFM (2.0 m/s) | 2.10 | | 600 LFM (3.0 m/s) | 1.60 | --- ## Common Use Cases * **Embedded Systems:** Cooling industrial microprocessors. * **Telecommunications:** Managing heat in networking switches and routers. * **Power Electronics:** Dissipating heat from high-speed voltage regulators.