### Overview of the ATS-06F-46-C1-R0 The **ATS-06F-46-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the "blue ICE" series, designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. --- ### Technical Specifications The table below outlines the key physical and thermal properties of this part: | Parameter | Specification | | :--- | :--- | | **Product Category** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Fin Style** | Straight Fin | | **Thermal Resistance (Flowing Air)** | ~11.5°C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | ~25.0°C/W | --- ### Key Features and Construction 1. **Material and Surface Treatment**: The unit is made from high-grade aluminum for optimal heat conductivity. The **Blue Anodized** finish provides both aesthetic value and surface protection against corrosion. 2. **Mounting Mechanism (Push-Pin)**: The "C1" in the part number indicates a specific hardware configuration. This model uses a **push-pin and spring** assembly. This ensures consistent pressure against the electronic chip, which improves thermal transfer compared to adhesive-only methods. 3. **Thermal Interface Material (TIM)**: This specific part usually comes pre-applied with **Phase Change Material (PCM)** on the base. This fills microscopic air gaps between the component and the heat sink for maximum heat dissipation. --- ### Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **06**: Series/Designation. * **F**: Material/Configuration code. * **46**: Dimensional code (specific to height and footprint). * **C1**: Mounting hardware (Plastic Push-Pins). * **R0**: Version/RoHS Compliance status. --- ### Applications * **Telecommunications**: Cooling routers and switches. * **Embedded Systems**: Small form factor PCs and industrial controllers. * **Power Supplies**: Managing heat in voltage regulators and MOSFETs.