ATS-06F-47-C1-R0
AI

The **ATS-06F-47-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **push-pin** attachment series, specifically designed for cooling electronic components such as CPUs, GPUs, or high-power ASICs.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 25mm x 25mm x 30mm |
| **Fin Style** | Straight (High-density) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Material** | Brass |
| **Thermal Resistance** | ~9.25°C/W (at 200 LFM) |
| **Pressure Drop** | 0.22 in. H2O (at 200 LFM) |
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### 2. Key Electronic Components & Design Features
#### A. Fin Geometry (Straight Fins)
The "F" in the part number indicates a straight fin design. These are optimized for **forced air convection**. The fins increase the surface area available to dissipate heat generated by the electronic component into the surrounding air.
#### B. Push-Pin Attachment Mechanism
Instead of using messy thermal adhesives or complex brackets, this part uses:
* **Plastic Push-Pins:** Flexible pins that snap into pre-drilled holes in the PCB (Printed Circuit Board).
* **Compression Springs:** These provide consistent pressure on the component, ensuring the heat sink stays in contact with the die even during vibration or thermal expansion.
#### C. Thermal Interface Material (TIM)
The "R0" at the end of the part number signifies that it comes with a **pre-applied phase-change material** or a high-performance thermal pad. This fills the microscopic air gaps between the component and the heat sink base to maximize heat transfer.
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### 3. Usage Context
This heat sink is typically found in:
1. **Network Switches:** Cooling localized controllers.
2. **Embedded Systems:** For industrial PCs where space is limited but height is available.
3. **Power Electronics:** Managing heat for MOSFET arrays or voltage regulators.
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- ⤷What is the difference between the C1 and C2 variants in ATS part numbers?
- ⤷ How do I calculate if the 9.25°C/W thermal resistance is sufficient for my chip?
- ⤷ What are the recommended PCB hole sizes for the push-pin mounting?