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  • ATS-06F-47-C1-R0

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    The **ATS-06F-47-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **push-pin** attachment series, specifically designed for cooling electronic components such as CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Fin Style** | Straight (High-density) | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Material** | Brass | | **Thermal Resistance** | ~9.25°C/W (at 200 LFM) | | **Pressure Drop** | 0.22 in. H2O (at 200 LFM) | --- ### 2. Key Electronic Components & Design Features #### A. Fin Geometry (Straight Fins) The "F" in the part number indicates a straight fin design. These are optimized for **forced air convection**. The fins increase the surface area available to dissipate heat generated by the electronic component into the surrounding air. #### B. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or complex brackets, this part uses: * **Plastic Push-Pins:** Flexible pins that snap into pre-drilled holes in the PCB (Printed Circuit Board). * **Compression Springs:** These provide consistent pressure on the component, ensuring the heat sink stays in contact with the die even during vibration or thermal expansion. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number signifies that it comes with a **pre-applied phase-change material** or a high-performance thermal pad. This fills the microscopic air gaps between the component and the heat sink base to maximize heat transfer. --- ### 3. Usage Context This heat sink is typically found in: 1. **Network Switches:** Cooling localized controllers. 2. **Embedded Systems:** For industrial PCs where space is limited but height is available. 3. **Power Electronics:** Managing heat for MOSFET arrays or voltage regulators. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between the C1 and C2 variants in ATS part numbers?
    • ⤷ How do I calculate if the 9.25°C/W thermal resistance is sufficient for my chip?
    • ⤷ What are the recommended PCB hole sizes for the push-pin mounting?