The **ATS-06F-61-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### Technical Specifications This part belongs to the "pushPIN™" series and is designed for integrated circuits (ICs) and other heat-generating electronic components. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-06F-61-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 22.07 °C/W (at 100 LFM) | | **Flow Pattern** | Straight-Fin | --- ### Key Electronic Components & Features #### 1. Heat Sink Body (Aluminum) The core of the part is made from 6063-grade aluminum. Aluminum is chosen for electronic parts due to its high thermal conductivity and lightweight properties, allowing it to draw heat away from a processor or power transistor efficiently. #### 2. Thermal Interface Material (TIM) * **Pre-Applied:** The "R0" designation typically indicates that the part comes with **T412** thermal interface material. * **Function:** This fills the microscopic air gaps between the electronic component (CPU/GPU/MOSFET) and the heat sink base to maximize heat transfer. #### 3. Attachment Mechanism (pushPIN™) Instead of adhesive or simple clips, this part uses a precision spring-loaded mechanism: * **Springs:** Provide consistent pressure (Force) across the electronic package to ensure optimal thermal contact. * **Hardware:** Available in brass or plastic pins depending on the specific assembly requirements. --- ### Thermal Performance Profile The effectiveness of this part in an electronic circuit depends on the airflow (LFM - Linear Feet per Minute). | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 22.07 | | 200 | 1.0 | 10.18 | | 400 | 2.0 | 5.17 | | 600 | 3.0 | 3.77 | --- ### Application in Electronics * **BGA Cooling:** Primarily used for Ball Grid Array (BGA) components. * **Power Supplies:** Cooling voltage regulators and power management ICs. * **Telecommunications:** Cooling chips in routers, switches, and high-speed data equipment where space (10mm height) is limited.