The **ATS-06F-64-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" attachment series designed for cooling integrated circuits (ICs). --- ## Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Base Part Number** | ATS-06F-64-C1-R0 | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass, 2-pin) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 9.36°C/W (Natural Convection / 1.0 m/s) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | --- ## Key Components and Features ### 1. Thermal Interface Material (TIM) This specific model comes pre-applied with **SAINT-GOBAIN C8000**, a phase-change thermal interface material. This ensures optimal heat transfer between the electronic chip and the aluminum base without needing external thermal paste. ### 2. Attachment Mechanism The "R0" suffix indicates the use of **Brass Push-Pins** with a compression spring. * **Purpose:** Provides consistent pressure on the processor, ensuring maximum thermal contact. * **Mounting:** Requires two holes drilled into the PCB at a specific distance (47mm pitch). ### 3. Fin Design The **Straight Fin** geometry is optimized for "active" cooling environments where there is a dedicated airflow (fans). The open-fin design allows air to flow through the heat sink in one direction, carrying heat away from the surface area. --- ## Usage and Application This heat sink is typically used for cooling the following electronic components: * **CPUs / Microprocessors** (Low-power embedded systems) * **FPGAs** (Field Programmable Gate Arrays) * **ASICs** (Application-Specific Integrated Circuits) * **GPU Modules** in industrial computing. ### Thermal Performance Overview * **@ 1.0 m/s airflow:** 9.36°C/W * **@ 2.0 m/s airflow:** 3.65°C/W * **@ 3.0 m/s airflow:** 2.80°C/W ---