ATS-06F-74-C3-R0
AI

The **ATS-06F-74-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Push-Pin" series, designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits.
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### 1. Technical Specifications
The following table summarizes the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimension (L x W x H)** | 25mm x 25mm x 25mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 9.03 °C/W (@ 100 LFM) |
| **Thermal Interface (TIM)** | T766 (Pre-applied) |
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### 2. Key Features
* **Thermal Efficiency:** The straight-fin design is optimized for high-performance airflow environments, providing a balance between surface area and pressure drop.
* **Push-Pin Attachment:** This model uses a plastic push-pin with a compression spring. This ensures a consistent mounting pressure (Force) on the component, improving thermal transfer.
* **Pre-applied TIM:** It comes with **T766 phase-change material** already applied to the base, which simplifies the assembly process and ensures optimal contact between the chip and the heat sink.
* **Material Construction:** Made from lightweight aluminum with a blue anodized finish, which provides basic corrosion resistance and a professional aesthetic.
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### 3. Application Use Cases
The ATS-06F-74-C3-R0 is typically used in the following electronic assemblies:
1. **Embedded Systems:** For cooling SoCs (System on Chips) in industrial computers.
2. **Networking Hardware:** High-speed routers or switches where vertical space allows for a 25mm height.
3. **Power Electronics:** Cooling MOSFETs or voltage regulators that require active or passive thermal management.
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### 4. Thermal Resistance Profile
The effectiveness of the heat sink changes based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow Speed (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Natural/Low) | 9.03 |
| 300 (Moderate) | 3.54 |
| 500 (High) | 2.58 |
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What are the PCB hole requirements for the push-pin mounting of this heat sink?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?
- ⤷ Is there a low-profile alternative to the ATS-06F-74-C3-R0?