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  • ATS-06F-74-C3-R0

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    The **ATS-06F-74-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Push-Pin" series, designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimension (L x W x H)** | 25mm x 25mm x 25mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 9.03 °C/W (@ 100 LFM) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features * **Thermal Efficiency:** The straight-fin design is optimized for high-performance airflow environments, providing a balance between surface area and pressure drop. * **Push-Pin Attachment:** This model uses a plastic push-pin with a compression spring. This ensures a consistent mounting pressure (Force) on the component, improving thermal transfer. * **Pre-applied TIM:** It comes with **T766 phase-change material** already applied to the base, which simplifies the assembly process and ensures optimal contact between the chip and the heat sink. * **Material Construction:** Made from lightweight aluminum with a blue anodized finish, which provides basic corrosion resistance and a professional aesthetic. --- ### 3. Application Use Cases The ATS-06F-74-C3-R0 is typically used in the following electronic assemblies: 1. **Embedded Systems:** For cooling SoCs (System on Chips) in industrial computers. 2. **Networking Hardware:** High-speed routers or switches where vertical space allows for a 25mm height. 3. **Power Electronics:** Cooling MOSFETs or voltage regulators that require active or passive thermal management. --- ### 4. Thermal Resistance Profile The effectiveness of the heat sink changes based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Speed (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 9.03 | | 300 (Moderate) | 3.54 | | 500 (High) | 2.58 |
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push-pin mounting of this heat sink?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ Is there a low-profile alternative to the ATS-06F-74-C3-R0?