The **ATS-06F-77-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc.** It is designed for cooling electronic components, specifically integrated circuits (ICs) and other surface-mount devices. ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance** | 9.28°C/W (at 100 LFM) to 1.47°C/W (at 700 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 25mm x 25mm x 20mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Spring Type** | Stainless Steel (ATS-PPS-06) | --- ### 2. Key Features and Design * **Fin Configuration:** This model uses a **Straight Fin** design, which is optimized for high-velocity airflow environments (active cooling). * **Attachment Mechanism:** It utilizes the **pushPIN™** system. This involves a spring-loaded pin that fits through pre-drilled holes in the Printed Circuit Board (PCB), ensuring constant pressure and optimal thermal contact with the component. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T412**, which is a high-performance thermal tape/pad to bridge the gap between the heat sink and the chip. --- ### 3. Electronic Performance Data The cooling efficiency depends on the Airflow (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | 100 (0.5 m/s) | 9.28 °C/W | | 300 (1.5 m/s) | 3.14 °C/W | | 500 (2.5 m/s) | 2.00 °C/W | | 700 (3.5 m/s) | 1.47 °C/W | --- ### 4. Applications This heat sink is typically found in: 1. **Networking Hardware:** Switches, routers, and gateways. 2. **Embedded Systems:** High-speed processors and FPGAs. 3. **Power Supplies:** Cooling voltage regulators and power MOSFETs. 4. **Telecommunications:** Base station equipment where airflow is managed.