The **ATS-06F-82-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the heat sink. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Line** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 10.97°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T412 (High performance) | --- ## 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCBA (Printed Circuit Board Assembly) layout. | Dimension | Value | | :--- | :--- | | **Length/Width (A/B)** | 30.00 mm x 30.00 mm | | **Height (C)** | 25.00 mm | | **Pitch (F)** | 35.00 mm | | **Weight** | ~40-50 grams (estimated) | --- ## 3. Core Components & Design Features ### A. Fin Design This model typically utilizes **Straight Fins** or **Cross-Cut Fins**. This design maximizes surface area for convective cooling while maintaining low pressure drop, making it ideal for systems with moderate airflow. ### B. pushPIN™ Attachment Unlike adhesive-based heat sinks, the "pushPIN" system uses a flexible, spring-loaded mechanism: * **Reliability:** Ensures constant pressure on the chip for optimal heat transfer. * **Installation:** Uses pre-drilled holes in the PCB, making it more secure against shocks and vibrations than thermal tape. ### C. Thermal Interface Material (TIM) The part comes with **T412** pre-applied. This is a "phase-change" or high-conductivity material that fills microscopic air gaps between the heat sink base and the electronic component, significantly reducing thermal resistance. --- ## 4. Typical Applications * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Systems:** Industrial PCs where space is limited but heat density is high. * **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators.