The **ATS-06F-83-C1-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" heat sink series, designed for high-performance thermal management in compact electronic assemblies. --- ### 1. Component Specification Table | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-06F-83-C1-R0 | | **Component Type** | Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 1.58 °C/W (@ 100 LFM) | | **Dimensions** | 30mm x 30mm x 20mm | --- ### 2. Physical Design Details The ATS-06F-83-C1-R0 is engineered to transfer heat away from high-power components like CPUs, GPUs, or power transistors. * **Footprint (30mm x 30mm):** A compact square base suitable for medium-sized integrated circuits (ICs). * **Height (20mm):** A mid-profile height that balances surface area for cooling with vertical space constraints in an enclosure. * **Fin Configuration:** It features a **Straight Fin** design. These are optimized for "forced air" environments where a fan provides a consistent, directional flow of air through the fins. * **Material:** Made from **Aluminum 6063**, which offers a high strength-to-weight ratio and excellent thermal conductivity. --- ### 3. Mechanical Attachment: The pushPIN™ System One of the defining "parts" of this assembly is the mounting hardware: 1. **Brass Pins:** High-durability pins that go through pre-drilled holes in the PCB. 2. **Stainless Steel Springs:** These provide a precise **"Compression Force"** (calculated to ensure maximum contact between the heat sink and the chip without cracking the silicon or the PCB). 3. **Flexible Attachment:** This system allows for easy installation and removal compared to permanent adhesives or thermal tapes. --- ### 4. Thermal Performance Data Thermal resistance indicates how efficiently the part moves heat. Lower numbers are better. | Airflow Velocity | 100 LFM | 200 LFM | 300 LFM | 400 LFM | 500 LFM | | :--- | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 1.58 | 1.01 | 0.84 | 0.74 | 0.68 | --- ### 5. Application Usage This part is typically found in: * **Telecommunications:** Cooling high-speed data processors. * **Embedded Systems:** For industrial computers where reliability is critical. * **Power Electronics:** Dissipating heat from voltage regulators or motor drivers.