The **ATS-06F-85-C3-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed for cooling integrated circuits (ICs) and other electronic packages. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Component Type** | Passive Heat Sink | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 10mm | | **Thermal Resistance** | 24.11 °C/W (at 100 LFM) | | **Fin Pattern** | Fine Pitch (straight fins) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature defined by ATS: * **ATS-06**: Indicates the series and specific manufacturing batch. * **F**: Represents the thermal performance/fin density category. * **85**: Refers to the specific design iteration and dimensions. * **C3**: Indicates the Thermal Interface Material (TIM). In this case, it usually refers to **T412**, a high-performance phase-change material or grease. * **R0**: Refers to the revision code and packaging. --- ### 3. Key Electronic Functions While the heat sink itself is not an active electronic component (like a transistor), it is critical for the "Thermal Management" layer of an electronic assembly: * **Heat Dissipation:** It increases the surface area of the heat-generating component (CPU, GPU, or MOSFET), allowing air to carry heat away more efficiently via convection. * **Thermal Protection:** By maintaining the junction temperature ($T_j$) within safe limits, it prevents thermal throttling and permanent silicon damage. * **Mechanical Stability:** The "pushPIN" system uses a brass or plastic pin with a compressed spring to provide precise, uniform pressure across the component, ensuring maximum contact with the die. --- ### 4. Typical Applications * **Embedded Systems:** For cooling SoCs (System on a Chip). * **Telecommunications:** Cooling high-speed data processing units. * **Power Electronics:** Used on voltage regulators or power modules that generate significant heat in a small footprint.