### Electronic Component Analysis: ATS-06F-86-C3-R0 The **ATS-06F-86-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient thermal management in compact electronic environments. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height (Fin Depth)** | 10.00mm | | **Fin Type** | Fine Pitch (Straight) | | **Thermal Resistance** | 17.85°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Key Features and Components The part is engineered to provide specific mechanical and thermal advantages: * **Push-Pin Attachment:** The "R0" designation refers to the specific push-pin hardware. It uses a flexible, spring-loaded mechanism that ensures consistent pressure between the heat sink and the heat source (CPU/GPU/FPGA), improving thermal conductivity. * **Material Science:** Constructed from 6063 aluminum, which offers a balance between lightweight design and high thermal conductivity. The Blue Anodized finish increases surface emissivity and provides corrosion resistance. * **Fin Configuration:** The "Fine Pitch" design increases the surface area available for heat dissipation, making it ideal for systems with high-density airflow. * **TIM (Thermal Interface Material):** Usually comes pre-applied with a high-performance thermal pad or grease (T766 or similar), ensuring immediate installation readiness. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **06** | Product Category / Series | | **F** | Fin Style (Fine Pitch) | | **86** | Dimensional Code (35x35mm) | | **C3** | Thermal Interface Material / Performance Grade | | **R0** | Packaging / Revision / Attachment Kit | --- ### 4. Application Areas This component is typically found in the following electronic sectors: 1. **Telecommunications:** Cooling for small-form-factor networking switches. 2. **Embedded Systems:** Thermal management for SoCs (System on Chips). 3. **Industrial PCs:** Cooling components in ruggedized, fan-less, or low-airflow environments. ---