ATS-06F-87-C3-R0
AI

The **ATS-06F-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling processors and high-power integrated circuits.
---
## 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 35.00mm x 35.00mm x 15.00mm |
| **Fin Style** | Straight (Square) |
| **Attachment Method** | Push-Pin (Steel) |
| **Thermal Resistance** | 13.30 °C/W (at 1.0 m/s airflow) |
| **Thermal Interface Material** | T412 (Pre-applied) |
---
## 2. Key Components & Design Features
### A. Fin Geometry (Straight Fin)
The "F" in the part number indicates a **straight fin** design. Straight fins are optimized for unidirectional airflow. This design allows for a low pressure drop and is ideal for systems with a dedicated cooling fan or a clear path for forced convection.
### B. Attachment Mechanism (Push-Pin)
Unlike adhesive-based heat sinks, the **R0** variant uses a mechanical push-pin system:
* **Spring-Loaded:** Provides consistent downward pressure on the chip to ensure maximum thermal transfer.
* **Durability:** The steel push-pin is more reliable than plastic clips or tape in high-vibration environments.
* **Hole Pattern:** Requires specific pre-drilled holes on the PCB (typically 3.0mm diameter).
### C. Thermal Interface Material (TIM)
The unit comes pre-applied with **T412**, which is a high-performance thermal pad. This eliminates the need for manual application of thermal grease and ensures a void-free contact between the heat sink and the electronic component.
---
## 3. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **06** | Product Family (Push-Pin series) |
| **F** | Fin Type (F = Straight Fin) |
| **87** | Specific Dimension Code (35x35mm) |
| **C3** | Material/Finish Code (Blue Anodized) |
| **R0** | Revision / Packaging Code |
---
## 4. Common Applications
* **Networking Hardware:** Switches, routers, and high-speed modems.
* **Embedded Systems:** Industrial PCs and single-board computers.
* **Power Supplies:** Cooling MOSFETs or Voltage Regulators (VRMs).
* **Consumer Electronics:** High-end audio/video processing units.
- ⤷
What is the hole-to-hole spacing required on the PCB for this specific heat sink?
- ⤷ How does the thermal resistance change at higher airflow speeds like 2.5 m/s?
- ⤷ Can the T412 thermal interface material be replaced with standard thermal paste?