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  • ATS-06F-87-C3-R0

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    The **ATS-06F-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling processors and high-power integrated circuits. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 35.00mm x 35.00mm x 15.00mm | | **Fin Style** | Straight (Square) | | **Attachment Method** | Push-Pin (Steel) | | **Thermal Resistance** | 13.30 °C/W (at 1.0 m/s airflow) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ## 2. Key Components & Design Features ### A. Fin Geometry (Straight Fin) The "F" in the part number indicates a **straight fin** design. Straight fins are optimized for unidirectional airflow. This design allows for a low pressure drop and is ideal for systems with a dedicated cooling fan or a clear path for forced convection. ### B. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the **R0** variant uses a mechanical push-pin system: * **Spring-Loaded:** Provides consistent downward pressure on the chip to ensure maximum thermal transfer. * **Durability:** The steel push-pin is more reliable than plastic clips or tape in high-vibration environments. * **Hole Pattern:** Requires specific pre-drilled holes on the PCB (typically 3.0mm diameter). ### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T412**, which is a high-performance thermal pad. This eliminates the need for manual application of thermal grease and ensures a void-free contact between the heat sink and the electronic component. --- ## 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **06** | Product Family (Push-Pin series) | | **F** | Fin Type (F = Straight Fin) | | **87** | Specific Dimension Code (35x35mm) | | **C3** | Material/Finish Code (Blue Anodized) | | **R0** | Revision / Packaging Code | --- ## 4. Common Applications * **Networking Hardware:** Switches, routers, and high-speed modems. * **Embedded Systems:** Industrial PCs and single-board computers. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators (VRMs). * **Consumer Electronics:** High-end audio/video processing units.
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required on the PCB for this specific heat sink?
    • ⤷ How does the thermal resistance change at higher airflow speeds like 2.5 m/s?
    • ⤷ Can the T412 thermal interface material be replaced with standard thermal paste?