The **ATS-06F-88-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed specifically for cooling electronic components such as CPUs, GPUs, or power transistors that generate significant heat. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-06F-88-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 10.11°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material** | T766 (Pre-applied phase change material) | --- ### Key Electronic Components & Features #### 1. Fin Design (XC Cut) The heat sink features a **straight fin** design with cross-cuts. This allows for multi-directional airflow, making it ideal for electronic enclosures where the airflow direction might be inconsistent or restricted. #### 2. PushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a **spring-loaded pushPIN system**. This provides: * **Constant Pressure:** Ensures optimal contact between the heat sink and the electronic chip. * **Reusability:** The part can be easily removed and reinstalled during maintenance or upgrades. * **Secure Fit:** Brass or plastic pins snap into pre-drilled holes in the PCB. #### 3. Thermal Interface Material (TIM) The "C2" in the part number refers to the **T766 thermal interface material**. This is a high-performance compound pre-applied to the base of the heat sink. It fills microscopic air gaps between the component and the heat sink to maximize heat transfer efficiency. #### 4. Blue Anodized Finish The blue anodization is not just for aesthetics; it provides **corrosion resistance** and slightly improves the surface emissivity, aiding in heat radiation. --- ### Use Cases in Electronics * **Embedded Systems:** Cooling microcontrollers or FPGAs in industrial computers. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. * **Networking Gear:** Used on chips inside routers or switches where vertical space is available (25mm height). ---