The **ATS-06F-93-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin | | **Dimension (L x W)** | 40mm x 40mm | | **Height** | 20mm | | **Thermal Resistance** | 11.87 °C/W (at 100 LFM) | | **Fin Pattern** | Straight Fin | --- ### 2. Physical Design Components The performance of this part is determined by four primary mechanical features: * **The Base:** A flat aluminum surface that makes direct contact with the electronic component. It is often paired with a Thermal Interface Material (TIM) like thermal paste or a phase-change pad. * **The Fins:** This model uses a **Straight Fin** design. These vertical ridges increase the surface area available for heat exchange with the surrounding air. * **Push-Pin Attachment:** Instead of messy adhesives or heavy screws, this uses a spring-loaded push-pin mechanism. This provides consistent pressure (clamping force) across the chip for optimal heat transfer. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves surface emissivity for better radiant heat transfer. --- ### 3. Thermal Performance Matrix Thermal resistance varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 11.87 | | 200 | 4.02 | | 300 | 2.33 | | 400 | 1.72 | | 500 | 1.42 | --- ### 4. Typical Applications This specific heat sink is commonly found in: * **Telecommunications:** Cooling networking chips in routers and switches. * **Embedded Systems:** Industrial PCs where space is limited but heat dissipation is critical. * **Power Supplies:** Managing heat for MOSFETs or voltage regulators.