The **ATS-06F-98-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table summarizes the core electronic and physical attributes of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Dimensions** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 15.29°C/W (Natural Airflow) | | **TIM (Thermal Interface Material)** | No TIM (Customizable) | --- ### 2. Key Components & Functions #### A. The Heat Sink Body * **Material:** Made of high-grade aluminum. Aluminum is chosen for its high thermal conductivity and lightweight properties, essential for sensitive electronic assemblies. * **Blue Anodized Finish:** This chemical treatment provides corrosion resistance and increases surface emissivity, slightly improving radiation cooling. #### B. The Push-Pin Mechanism * **Installation:** Uses a plastic push-pin through pre-drilled holes in the PCB. * **Spring Load:** The "R0" designation refers to a specific spring force. This ensures consistent pressure against the electronic component (like a BGA or CPU), which is critical for minimizing the thermal contact resistance. #### C. Fin Geometry * **Straight Fins:** These are optimized for high-velocity airflow environments (active cooling). The spacing allows air to pass through the channels, stripping heat away from the base plate. --- ### 3. Thermal Performance Profile Thermal resistance is the measure of how effectively the part moves heat. Lower values indicate better performance under airflow. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 4.66 | | 400 (2.0 m/s) | 3.07 | | 600 (3.0 m/s) | 2.51 | | 800 (4.0 m/s) | 2.15 | --- ### 4. Typical Applications This specific part is used to cool integrated circuits that generate moderate to high heat, such as: * **ASICs and FPGAs:** Used in networking and telecommunications hardware. * **Processors:** Low-power embedded CPUs. * **Power Modules:** High-density power supplies requiring compact heat dissipation.