ATS-06F-99-C1-R0
AI

The **ATS-06F-99-C1-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, or power transistors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Property | Specification | Details |
| :--- | :--- | :--- |
| **Series** | pushPIN™ | Uses a spring-loaded attachment mechanism |
| **Material** | Aluminum | Lightweight with high thermal conductivity |
| **Finish** | Blue Anodized | Increases surface emissivity and corrosion resistance |
| **Thermal Resistance** | 11.49 °C/W (Unducted) | Measured at 100 LFM (Linear Feet per Minute) |
| **Dimensions** | 45mm x 45mm | Square footprint |
| **Height** | 20mm | Height of the fins |
| **Attachment Type** | Push-Pin | Secure mechanical fastening |
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### 2. Component Design Features
The ATS-06F-99-C1-R0 is engineered for specific airflow conditions and mechanical reliability:
* **Fine Pitch Fins:** The "F" in the part number indicates a fine-pitch fin design, which maximizes surface area for heat dissipation in high-airflow environments.
* **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412** thermal tape or grease, ensuring a low-resistance thermal path between the chip and the heat sink.
* **Compression Springs:** The push-pin mechanism uses a precisely calibrated spring to provide consistent pressure, preventing the heat sink from shifting during vibration or mechanical shock.
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### 3. Applications
This part is commonly used in industrial and computing electronics where space is limited but thermal loads are significant:
1. **Networking Hardware:** Routers, switches, and base stations.
2. **Embedded Systems:** Industrial PCs and automation controllers.
3. **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs).
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### 4. Comparison of Airflow Performance
Thermal resistance varies significantly based on the velocity of the air passing through the fins:
| Air Velocity (LFM) | 100 | 300 | 500 | 700 |
| :--- | :--- | :--- | :--- | :--- |
| **Resistance (°C/W)** | 11.49 | 3.95 | 2.15 | 1.54 |
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- ⤷What is the difference between fine-pitch and coarse-pitch heat sinks?
- ⤷ How do I choose the correct push-pin size for my PCB thickness?
- ⤷ Can this heat sink be used without a fan (passive cooling)?