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  • ATS-06F-99-C1-R0

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    The **ATS-06F-99-C1-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Series** | pushPIN™ | Uses a spring-loaded attachment mechanism | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and corrosion resistance | | **Thermal Resistance** | 11.49 °C/W (Unducted) | Measured at 100 LFM (Linear Feet per Minute) | | **Dimensions** | 45mm x 45mm | Square footprint | | **Height** | 20mm | Height of the fins | | **Attachment Type** | Push-Pin | Secure mechanical fastening | --- ### 2. Component Design Features The ATS-06F-99-C1-R0 is engineered for specific airflow conditions and mechanical reliability: * **Fine Pitch Fins:** The "F" in the part number indicates a fine-pitch fin design, which maximizes surface area for heat dissipation in high-airflow environments. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412** thermal tape or grease, ensuring a low-resistance thermal path between the chip and the heat sink. * **Compression Springs:** The push-pin mechanism uses a precisely calibrated spring to provide consistent pressure, preventing the heat sink from shifting during vibration or mechanical shock. --- ### 3. Applications This part is commonly used in industrial and computing electronics where space is limited but thermal loads are significant: 1. **Networking Hardware:** Routers, switches, and base stations. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs). --- ### 4. Comparison of Airflow Performance Thermal resistance varies significantly based on the velocity of the air passing through the fins: | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 11.49 | 3.95 | 2.15 | 1.54 | ---
    ✨ Follow-up Questions
    • ⤷What is the difference between fine-pitch and coarse-pitch heat sinks?
    • ⤷ How do I choose the correct push-pin size for my PCB thickness?
    • ⤷ Can this heat sink be used without a fan (passive cooling)?