The **ATS-06G-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Key Specifications The following table summarizes the technical characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Fin Style** | Straight Fin | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.77°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Finish** | Blue Anodized | | **Interface Material** | T412 (Phase-change material) | --- ### 2. Electronic & Mechanical Features #### A. pushPIN™ Attachment System This part uses a patented **pushPIN™** system. In electronic PCB design, this ensures a secure, reliable connection to the board without requiring high-stress manual pressure. It provides: * Pre-assembled springs for precise pressure. * Plastic or brass pins for different board thicknesses. #### B. Thermal Performance Thermal resistance is critical in electronics. A lower value (measured in °C/W) means the heat sink is more efficient at moving heat away from the silicon die. * **Active Cooling:** When paired with airflow, the efficiency increases significantly (dropping to ~1.70°C/W at 800 LFM). * **T412 Thermal Interface Material (TIM):** This is pre-applied to the base. It fills microscopic air gaps between the component and the heat sink to maximize heat transfer. #### C. Straight Fin Design The straight fin geometry is optimized for **unidirectional airflow**. In a standard server or industrial PC chassis, this design allows air to flow through the fins with minimal pressure drop. --- ### 3. Applications This specific heat sink is commonly used for: 1. **Network Switches/Routers:** Cooling ASICs and processors. 2. **Industrial PCs:** Ensuring stability in harsh thermal environments. 3. **Power Supplies:** Dissipating heat from MOSFETs and voltage regulators. ---