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  • ATS-06G-152-C2-R0

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    The **ATS-06G-152-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high-efficiency cooling for electronic components like BGA (Ball Grid Array) packages. --- ### ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-06G-152-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 3.32°C/W (at 200 LFM) | | **Base Dimensions** | 35mm x 35mm | | **Height** | 25mm | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### ## Key Features & Components ### 1. maxiFLOW™ Fin Geometry The "G" in the part number signifies the **maxiFLOW** design. Unlike standard straight-fin heat sinks, these feature a spread-fin pattern that increases the surface area and promotes better air turbulence. This significantly reduces thermal resistance while maintaining a low pressure drop. ### 2. pushPIN™ Attachment System This model uses a specialized attachment mechanism consisting of: * **Plastic or Brass Push Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Ensure consistent pressure (load) is applied to the component, maximizing heat transfer across the interface. * **Stability:** Prevents the heat sink from shifting during mechanical shock or vibration. ### 3. Thermal Interface Material (TIM) The heat sink comes with **T766** pre-applied to the base. * **Function:** Fills microscopic air gaps between the component (CPU/FPGA) and the heat sink base. * **Benefit:** Reduces contact resistance and eliminates the need for manual thermal paste application. --- ### ## Application Use Cases This specific part is typically used in space-constrained environments requiring high-performance cooling: * **Networking:** Switches, routers, and high-speed modems. * **Telecommunications:** Base stations and signal processing units. * **Embedded Systems:** Industrial PCs and single-board computers.
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods for ATS heat sinks if pushPIN is not suitable?
    • ⤷ How does the blue anodized finish impact the thermal performance?
    • ⤷ Can this heat sink be used for passive cooling without a fan?