ATS-06G-152-C2-R0
AI

The **ATS-06G-152-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high-efficiency cooling for electronic components like BGA (Ball Grid Array) packages.
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### ## Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Part Number** | ATS-06G-152-C2-R0 |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 3.32°C/W (at 200 LFM) |
| **Base Dimensions** | 35mm x 35mm |
| **Height** | 25mm |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### ## Key Features & Components
### 1. maxiFLOW™ Fin Geometry
The "G" in the part number signifies the **maxiFLOW** design. Unlike standard straight-fin heat sinks, these feature a spread-fin pattern that increases the surface area and promotes better air turbulence. This significantly reduces thermal resistance while maintaining a low pressure drop.
### 2. pushPIN™ Attachment System
This model uses a specialized attachment mechanism consisting of:
* **Plastic or Brass Push Pins:** Inserted through pre-drilled holes in the PCB.
* **Compression Springs:** Ensure consistent pressure (load) is applied to the component, maximizing heat transfer across the interface.
* **Stability:** Prevents the heat sink from shifting during mechanical shock or vibration.
### 3. Thermal Interface Material (TIM)
The heat sink comes with **T766** pre-applied to the base.
* **Function:** Fills microscopic air gaps between the component (CPU/FPGA) and the heat sink base.
* **Benefit:** Reduces contact resistance and eliminates the need for manual thermal paste application.
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### ## Application Use Cases
This specific part is typically used in space-constrained environments requiring high-performance cooling:
* **Networking:** Switches, routers, and high-speed modems.
* **Telecommunications:** Base stations and signal processing units.
* **Embedded Systems:** Industrial PCs and single-board computers.
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What are the alternative attachment methods for ATS heat sinks if pushPIN is not suitable?
- ⤷ How does the blue anodized finish impact the thermal performance?
- ⤷ Can this heat sink be used for passive cooling without a fan?