The **ATS-06G-174-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and surface-mount devices (SMDs). --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below are the primary technical parameters: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 4.02°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 35mm | | **Fin Pattern** | Fine Pitch (Cross-cut) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Design Features #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical **pushPIN™** system. * **Brass Components:** The pins are often brass with a stainless steel spring. * **Compression:** It provides precise pressure to ensure maximum contact between the chip and the heat sink, which is critical for high-vibration environments. #### B. Cross-Cut Fin Design The electronic part features a **rectangular fin array**. This design allows for: * **Omnidirectional Airflow:** Heat can be dissipated regardless of the direction of the fan's air current. * **Increased Surface Area:** The "cross-cut" increases the surface area-to-volume ratio, making it more efficient than standard extruded heat sinks. #### C. Thermal Interface Material (T766) This part comes with **T766 TIM** pre-applied to the base. * **Function:** It fills microscopic air gaps between the electronic component (CPU/GPU/FPGA) and the aluminum base. * **Conductivity:** It is a high-performance phase-change material that ensures minimal thermal impedance. --- ### 3. Application Use Cases This specific heat sink is typically found in the following electronic systems: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Voltage regulators and power modules that generate significant heat in a small footprint (30mm x 30mm). ---