The **ATS-06G-175-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions | Leading provider of thermal management solutions. | | **Material** | Aluminum | Provides a balance of weight, cost, and thermal conductivity. | | **Finish** | Blue Anodized | Increases surface emissivity and provides corrosion resistance. | | **Base Shape** | Square | Standard footprint for typical IC packaging. | | **Attachment Method** | Push-Pin | Uses a spring-loaded pin for secure mounting to the PCB. | | **Thermal Resistance** | 13.52°C/W (Natural Convection) | Efficiency improves significantly with active airflow. | --- ### 2. Key Features and Design * **push-PIN™ Attachment:** This system allows for easy assembly and provides the exact pressure required for optimal thermal interface material (TIM) performance. * **High Performance Fin Design:** The "straight fin" or "cross-cut" geometry (depending on the specific sub-series) is engineered to maximize surface area while minimizing pressure drop in forced-air environments. * **Pre-Applied Thermal Interface Material (TIM):** Most "C2" variants come with a high-performance thermal pad or grease pre-applied to the base to ensure low thermal resistance between the chip and the heat sink. * **Component Compatibility:** The design is optimized for a wide variety of industry-standard hole patterns on printed circuit boards (PCBs). --- ### 3. Dimensional Data Physical dimensions are critical for ensuring the part fits within the mechanical constraints of an electronic enclosure: | Dimension | Value | | :--- | :--- | | **Size (L x W)** | 35mm x 35mm | | **Height** | 10mm | | **Hole Spacing** | ~40mm (Center to Center) | --- ### 4. Thermal Performance Comparison The effectiveness of this heat sink varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 13.52 | | 300 | 5.24 | | 500 | 3.85 | | 700 | 3.21 | ---