ATS-06G-183-C2-R0
AI

The **ATS-06G-183-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components.
### 1. Key Technical Specifications
Below are the primary physical and thermal characteristics of this part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Fin Type** | Fine Pitch (Cross-Cut) |
| **Thermal Resistance** | 5.37°C/W (at 100 LFM) |
| **Dimensions** | 40mm x 40mm x 20mm |
---
### 2. Physical Design Details
The part is engineered for specific airflow conditions to ensure maximum cooling efficiency for sensitive electronics:
* **Heat Sink Profile:** It features a **Cross-Cut** fin pattern. This design allows for multidirectional airflow, meaning the air doesn't have to come from one specific direction to cool the component effectively.
* **Push-Pin Mounting:** The "06G" and "R0" designations often refer to the specific hardware kit. The push-pin mechanism uses a spring-loaded pin to provide consistent pressure (Normal Force) between the heat sink and the chip, ensuring a better thermal interface.
* **Blue Anodized Finish:** The surface treatment is not just for aesthetics; anodizing protects the aluminum from corrosion and slightly improves heat radiation.
---
### 3. Thermal Performance Metrics
Thermal resistance determines how many degrees Celsius the component's temperature will rise for every watt of power it dissipates.
| Airflow Speed (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 5.37 |
| 200 (1.0 m/s) | 3.00 |
| 400 (2.0 m/s) | 2.20 |
| 600 (3.0 m/s) | 1.81 |
---
### 4. Part Number Breakdown
The part number follows a specific nomenclature used by ATS:
* **ATS:** Manufacturer prefix.
* **06:** Identifying code for the specific push-pin/spring combination.
* **G:** Material/Series indicator.
* **183:** Dimensional code for the length, width, and height.
* **C2:** Indicates the Thermal Interface Material (TIM) type (typically a pre-applied high-performance thermal pad or grease).
* **R0:** Revision or packaging code.
- ⤷
What are the compatible mounting hole sizes for this heat sink?
- ⤷ Does the 'C2' designation include a pre-applied thermal interface material?
- ⤷ Which electronic components (BGAs
- ⤷ FPGAs) is this heat sink best suited for?