Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-06G-183-C2-R0

  • AI
    The **ATS-06G-183-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components. ### 1. Key Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Type** | Fine Pitch (Cross-Cut) | | **Thermal Resistance** | 5.37°C/W (at 100 LFM) | | **Dimensions** | 40mm x 40mm x 20mm | --- ### 2. Physical Design Details The part is engineered for specific airflow conditions to ensure maximum cooling efficiency for sensitive electronics: * **Heat Sink Profile:** It features a **Cross-Cut** fin pattern. This design allows for multidirectional airflow, meaning the air doesn't have to come from one specific direction to cool the component effectively. * **Push-Pin Mounting:** The "06G" and "R0" designations often refer to the specific hardware kit. The push-pin mechanism uses a spring-loaded pin to provide consistent pressure (Normal Force) between the heat sink and the chip, ensuring a better thermal interface. * **Blue Anodized Finish:** The surface treatment is not just for aesthetics; anodizing protects the aluminum from corrosion and slightly improves heat radiation. --- ### 3. Thermal Performance Metrics Thermal resistance determines how many degrees Celsius the component's temperature will rise for every watt of power it dissipates. | Airflow Speed (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.37 | | 200 (1.0 m/s) | 3.00 | | 400 (2.0 m/s) | 2.20 | | 600 (3.0 m/s) | 1.81 | --- ### 4. Part Number Breakdown The part number follows a specific nomenclature used by ATS: * **ATS:** Manufacturer prefix. * **06:** Identifying code for the specific push-pin/spring combination. * **G:** Material/Series indicator. * **183:** Dimensional code for the length, width, and height. * **C2:** Indicates the Thermal Interface Material (TIM) type (typically a pre-applied high-performance thermal pad or grease). * **R0:** Revision or packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the compatible mounting hole sizes for this heat sink?
    • ⤷ Does the 'C2' designation include a pre-applied thermal interface material?
    • ⤷ Which electronic components (BGAs
    • ⤷ FPGAs) is this heat sink best suited for?