The **ATS-06G-192-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-06G-192-C2-R0 | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Attachment Type** | Push-pin (with Compression Springs) | | **Thermal Resistance** | 2.35°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body (Thermal Dissipation) The main body is made of **aluminum**, which provides a high thermal conductivity-to-weight ratio. The "Blue Anodized" finish isn't just aesthetic; it provides: * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Improved Emissivity:** Enhances radiant heat transfer. #### 2. Push-pin Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical **push-pin and spring mechanism**: * **Precision Pressure:** The springs ensure consistent pressure between the heat sink and the electronic component, which is critical for minimizing thermal contact resistance. * **Reliability:** Mechanical mounting is less likely to fail over time due to heat cycles compared to some thermal tapes. #### 3. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Purpose:** This material fills microscopic air gaps between the heat sink and the electronic chip (IC). * **Performance:** It ensures maximum heat transfer efficiency from the silicon die to the aluminum fins. #### 4. Fin Design The "192" in the part number refers to the specific fin density and geometry. High-density fins increase the surface area available for air-cooling, allowing for better heat dissipation in systems with forced airflow (fans). --- ### Application Use Cases * **Embedded Systems:** Cooling high-speed processors. * **Telecommunications:** Cooling ASICs in networking hardware. * **Industrial Controls:** Preventing thermal throttling in power management modules.