The **ATS-06G-199-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling integrated circuits (ICs) and other PCB-mounted components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-06G-199-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 6.00mm | | **Thermal Resistance** | 15.83°C/W (Unducted Flow @ 200 LFM) | | **Fin Type** | Straight | --- ### 2. Design and Component Breakdown #### A. The Heat Sink Body The unit is a **Low-Profile** heat sink, standing only 6mm high. This makes it ideal for dense electronic assemblies where vertical space is limited (e.g., blade servers or 1U rackmount equipment). The **Blue Anodized** finish is not just aesthetic; it increases the surface emissivity and protects the aluminum from corrosion. #### B. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, the "C2" designation indicates it uses a **Push-Pin** attachment: * **Material:** Usually plastic or brass (this specific model uses plastic). * **Spring:** A compression spring is included to ensure constant pressure on the chip, which improves heat transfer and compensates for thermal expansion. * **Installation:** Requires pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **ATS-PPS-06** (or similar T766 phase-change material), which fills the microscopic air gaps between the component surface and the heat sink base. --- ### 3. Application Use Cases This part is commonly used for cooling the following electronic components: 1. **BGA Packages:** High-speed processors or FPGAs. 2. **Power Electronics:** Voltage regulators or MOSFET arrays. 3. **Networking Equipment:** Routers and switches that require passive or low-airflow cooling solutions. --- ### 4. Thermal Performance Comparison The effectiveness of the ATS-06G-199-C2-R0 depends heavily on the airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 15.83 | | 400 | 2.0 | 10.70 | | 600 | 3.0 | 8.90 |