ATS-06G-25-C2-R0
AI

The **ATS-06G-25-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Push-PIN" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat-generating ICs (Integrated Circuits).
### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
|:---|:---|
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-06G-25-C2-R0 |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
| **Dimensions** | 25mm x 25mm x 20mm |
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### 2. Design Characteristics
This heat sink is engineered for optimal airflow efficiency within compact electronic enclosures:
* **Fine Pitch Fins:** The "G" in the part number often refers to the specific fin pattern (Cross-cut), which allows for airflow from multiple directions, making it ideal for systems with unpredictable air patterns.
* **Blue Anodized Coating:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves surface emissivity for better radiant heat transfer.
* **Integrated TIM:** The unit comes with **T766 thermal phase-change material** pre-applied to the base. This ensures a low thermal resistance path between the electronic chip and the heat sink without needing separate thermal paste.
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### 3. Mounting System
The **Push-Pin and Spring** mechanism provides several advantages for PCB assembly:
1. **Consistent Pressure:** The springs ensure that a precise amount of downward force is applied to the chip, preventing damage while maximizing thermal contact.
2. **Ease of Installation:** It requires pre-drilled holes in the PCB (typically 3mm or 3.2mm). The pins "snap" into place, reducing assembly time on a production line.
3. **Vibration Resistance:** Unlike simple adhesive tapes, the mechanical fastening is secure against shocks and high-vibration environments.
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### 4. Thermal Performance
The performance of this heat sink depends on the airflow (Measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
|:---|:---|
| **200 LFM** | ~6.30 |
| **400 LFM** | ~4.10 |
| **600 LFM** | ~3.40 |
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- ⤷
What are the PCB hole diameter requirements for the ATS Push-Pin system?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?
- ⤷ Can this heat sink be used for passive cooling without a fan?