The **ATS-06G-28-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "push pin" heat sink series. --- ### 1. Technical Specifications The following table summarizes the core electronic and mechanical parameters of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-06G-28-C2-R0 | | **Heat Sink Type** | Push Pin (Spring Loaded) | | **Attachment Type** | Push Pin (Plastic or Brass) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 6.57°C/W (at 200 LFM) | | **Flow Direction** | Vertical/Universal | | **Dimensions (L x W x H)** | 28mm x 28mm x 25mm | --- ### 2. Functional Components Electronic parts like the ATS-06G-28-C2-R0 are composed of several critical design elements to ensure effective cooling of semiconductors: * **Heat Sink Base:** The flat bottom surface (28x28mm) that makes direct contact with the electronic chip (CPU, FPGA, or MOSFET). * **Fins:** These are the vertical structures that increase the surface area for heat dissipation. The "G" in the series usually denotes a specific fin pattern (Cross-cut) that allows for omnidirectional airflow. * **Push Pin Mechanism:** This part uses a spring-loaded pin to provide a specific amount of downward force, ensuring consistent thermal interface contact between the sink and the PCB. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** (a high-performance thermal grease) to fill microscopic air gaps between the component and the sink. --- ### 3. Application and Usage This part is used to protect sensitive electronic circuits from thermal throttling or permanent damage. * **Main Goal:** Dissipate heat generated by high-power density components. * **Common Targets:** Small form-factor processors, telecommunications equipment, and power supplies. * **Airflow Requirement:** Optimized for both natural convection and forced-air (fan) environments. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 6.57 | | 400 | 2.50 | | 600 | 1.80 |