Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-06G-29-C2-R0

  • AI
    The **ATS-06G-29-C2-R0** is a high-performance electronic component belonging to the thermal management category. Specifically, it is a **Heatsink** designed for cooling electronic integrated circuits (ICs) and other heat-generating components. ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Base Series** | blueICE™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions** | 45.00mm x 45.00mm | | **Height (Off Base)** | 20.00mm | | **Thermal Resistance** | 7.57°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Electronic Application & Function In an electronic system, the ATS-06G-29-C2-R0 serves the following functions: * **Heat Dissipation:** It increases the surface area of the component (like a CPU, FPGA, or GPU), allowing heat to transfer more efficiently into the surrounding air. * **Thermal Protection:** By maintaining lower operating temperatures, it prevents "thermal throttling" and extends the lifespan of sensitive semiconductor materials. * **Mechanical Stability:** The use of a **Push-Pin** attachment system ensures consistent pressure between the heatsink and the chip, which is critical for the effectiveness of the Thermal Interface Material (TIM). ### 3. Key Component Features * **Material (Aluminum):** Provides a balance between high thermal conductivity and low weight, making it ideal for PCB mounting without causing mechanical stress. * **Anodized Coating:** The blue anodized finish is not just aesthetic; it provides corrosion resistance and improves emissivity for better radiant heat transfer. * **Push-Pin Mechanism:** This specific model uses a spring-loaded push-pin system. This allows for quick assembly and provides a specific "clamping force" required to optimize thermal contact. --- ### 4. Comparison of Airflow Performance The thermal resistance of this part varies based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 7.57 | | 200 | 4.43 | | 300 | 3.22 | | 500 | 2.15 |
    ✨ Follow-up Questions
    • ⤷ What are the recommended thermal interface materials (TIM) to use with this heatsink?
    • ⤷ How do I calculate if this heatsink provides enough cooling for my specific IC power rating?
    • ⤷ What are the mechanical clearance requirements for the push-pin mounting holes?