ATS-06G-29-C2-R0
AI

The **ATS-06G-29-C2-R0** is a high-performance electronic component belonging to the thermal management category. Specifically, it is a **Heatsink** designed for cooling electronic integrated circuits (ICs) and other heat-generating components.
### 1. Technical Specifications
The following table highlights the primary physical and thermal characteristics of this part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Base Series** | blueICE™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimensions** | 45.00mm x 45.00mm |
| **Height (Off Base)** | 20.00mm |
| **Thermal Resistance** | 7.57°C/W (at 100 LFM) |
| **Fin Style** | Straight Fin |
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### 2. Electronic Application & Function
In an electronic system, the ATS-06G-29-C2-R0 serves the following functions:
* **Heat Dissipation:** It increases the surface area of the component (like a CPU, FPGA, or GPU), allowing heat to transfer more efficiently into the surrounding air.
* **Thermal Protection:** By maintaining lower operating temperatures, it prevents "thermal throttling" and extends the lifespan of sensitive semiconductor materials.
* **Mechanical Stability:** The use of a **Push-Pin** attachment system ensures consistent pressure between the heatsink and the chip, which is critical for the effectiveness of the Thermal Interface Material (TIM).
### 3. Key Component Features
* **Material (Aluminum):** Provides a balance between high thermal conductivity and low weight, making it ideal for PCB mounting without causing mechanical stress.
* **Anodized Coating:** The blue anodized finish is not just aesthetic; it provides corrosion resistance and improves emissivity for better radiant heat transfer.
* **Push-Pin Mechanism:** This specific model uses a spring-loaded push-pin system. This allows for quick assembly and provides a specific "clamping force" required to optimize thermal contact.
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### 4. Comparison of Airflow Performance
The thermal resistance of this part varies based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Natural/Low) | 7.57 |
| 200 | 4.43 |
| 300 | 3.22 |
| 500 | 2.15 |
- ⤷
What are the recommended thermal interface materials (TIM) to use with this heatsink?
- ⤷ How do I calculate if this heatsink provides enough cooling for my specific IC power rating?
- ⤷ What are the mechanical clearance requirements for the push-pin mounting holes?