The **ATS-06G-41-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W)** | 40mm x 40mm | | **Height (Fin Height)** | 17.5mm | | **Thermal Resistance** | 10.07°C/W (Unducted Flow @ 200 LFM) | | **Flow Pattern** | maxiFLOW (Tapered Fin Design) | --- ### 2. Key Electronic Features #### A. maxiFLOW™ Fin Geometry The "G" in the part number signifies the **maxiFLOW™** design. Unlike standard rectangular heat sinks, these fins are tapered. This geometry: * Reduces pressure drop across the heat sink. * Increases surface area for convection. * Is ideal for environments where airflow is constrained or multidirectional. #### B. pushPIN™ Attachment System This component uses the **pushPIN™** mounting mechanism. In high-reliability electronic assemblies, this is superior to simple adhesive tapes because: * It provides a **consistent pressure** (compression force) on the TIM (Thermal Interface Material), ensuring better heat transfer. * The integrated springs allow for thermal expansion/contraction without damaging the PCB or the silicon die. #### C. Thermal Interface Material (TIM) The **C3** designation indicates that this model comes pre-applied with **ATS-54** (a high-performance phase-change thermal material) or a specific thermal grease. This ensures low contact resistance between the electronic chip and the aluminum base. --- ### 3. Application Use Cases This specific size (40x40mm) is commonly used for: 1. **Network Switches/Routers:** Cooling high-speed ASICs. 2. **Embedded Systems:** Industrial PCs where passive or semi-passive cooling is required. 3. **Power Electronics:** Cooling MOSFET arrays or power modules. --- ### 4. Thermal Performance Comparison *Performance varies based on Airflow (LFM - Linear Feet per Minute).* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 10.07 | | 400 | 2.0 | 5.09 | | 600 | 3.0 | 3.52 |