The **ATS-06G-47-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series and is designed specifically for thermal management in electronic components like CPUs, GPUs, and high-power chipsets. --- ### 1. Technical Specifications The part number provides specific details about the dimensions, material, and thermal performance. | Specification | Details | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Base Dimensions** | 45mm x 45mm | | **Height** | 20mm | | **Fin Pattern** | Straight Fin | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 9.30°C/W (Unducted) to 1.33°C/W (Ducted @ 700 LFM) | --- ### 2. Component Breakdown The assembly of the ATS-06G-47-C2-R0 consists of several key electronic cooling elements: #### A. The Heat Sink (Thermal Mass) * **Straight Fin Design:** The fins are arranged in a parallel, straight configuration. This is ideal for systems where the airflow direction is predictable and unidirectional. * **Material (AL6063):** This aluminum alloy is preferred for its high thermal conductivity and lightweight properties, making it efficient at pulling heat away from the silicon die. #### B. The PushPIN™ Attachment * **Mechanical Stability:** Instead of using adhesive tape, this part uses a mechanical push-pin system. This ensures consistent pressure between the heat sink and the electronic component, which is critical for maximizing thermal transfer. * **Spring-Loaded:** The springs allow for thermal expansion and contraction without damaging the PCB or the chip package. #### C. Thermal Interface Material (TIM) * **Pre-Applied T412:** This specific model comes with **T412** thermal interface material pre-applied to the base. This fills microscopic air gaps between the component and the heat sink, significantly lowering thermal resistance. --- ### 3. Application & Compatibility This part is commonly used in industrial and telecommunications hardware. * **PCB Hole Pattern:** Designed for a standard **38mm x 38mm** hole pitch. * **Electronic Compatibility:** Best suited for high-density power electronics, BGA (Ball Grid Array) packages, and FPGA (Field Programmable Gate Arrays). --- ### 4. Cooling Performance (LFM) Thermal resistance varies based on the Linear Feet per Minute (LFM) of airflow provided by system fans: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 9.30 | | 300 | 2.50 | | 500 | 1.60 | | 700 | 1.33 | ---