The **ATS-06G-55-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for high-density electronic cooling. --- ### 1. Technical Specifications Below are the primary mechanical and thermal specifications for this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 23.98 °C/W (at 1.0 m/s flow) | | **Compliance** | RoHS and REACH compliant | --- ### 2. Design and Functional Features #### A. pushPIN™ Attachment System The "R0" at the end of the part number indicates the use of the **pushPIN™** attachment mechanism. This system provides: - **Consistent Pressure:** Pre-assembled springs ensure constant pressure on the electronic component (CPU/GPU), optimizing heat transfer. - **Easy Installation:** Can be mounted into pre-drilled holes in the PCB without complex tools. - **Hardware Variety:** Available in different spring tensions and pin materials (plastic/brass). #### B. Material and Coating - **Aluminum AL6063:** Chosen for its excellent thermal conductivity and lightweight properties. - **Blue Anodizing:** This is not just for aesthetics; the anodized layer increases surface emissivity, slightly improving radiation heat transfer, and provides corrosion resistance. #### C. Thermal Performance (Flow Dependent) Thermal resistance varies significantly based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | 200 (1.0 m/s) | 400 (2.0 m/s) | 600 (3.0 m/s) | | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 23.98 | 6.31 | 3.56 | --- ### 3. Application Use Cases The **ATS-06G-55-C2-R0** is typically used in space-constrained environments where high-efficiency cooling is required for surface-mount components: - **Telecommunications:** Routers, switches, and base stations. - **Embedded Computing:** Industrial PC boards and single-board computers (SBCs). - **Power Supplies:** Cooling MOSFETs or power regulators. --- ### 4. Part Number Breakdown - **ATS:** Advanced Thermal Solutions (Manufacturer). - **06:** Series/Category identifier. - **G:** Material/Fin type indicator. - **55:** Specific footprint/size code. - **C2:** Thermal Interface Material (TIM) type (typically indicates a pre-applied high-performance pad). - **R0:** Revision and attachment type.