The **ATS-06G-66-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications This part is designed for high-density electronic cooling, typically used on BGAs (Ball Grid Arrays) and other surface-mount components. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 0.82°C/W (at 200 LFM) | --- ### 2. Key Component Features #### A. The pushPIN™ Attachment System The "R0" suffix denotes the use of the ATS **pushPIN™** system. This is a crucial mechanical feature for electronic parts: * **Compression Springs:** Provides precise pressure to improve thermal interface material (TIM) performance. * **Ease of Install:** No tools are required for mounting, reducing the risk of damaging delicate PCBs. #### B. Thermal Performance The part uses a **high-aspect-ratio fin design**. This maximizes the surface area within a small footprint (45mm x 45mm), allowing it to dissipate heat from high-power processors or ASICs effectively. #### C. Material and Coating * **Aluminum:** Chosen for its balance between thermal conductivity and weight. * **Blue Anodizing:** Aside from aesthetics, the anodized layer provides electrical insulation and corrosion resistance, preventing short circuits if the heat sink accidentally touches nearby components. --- ### 3. Common Applications In the electronics industry, this specific heat sink is often found in: 1. **Telecommunications:** Cooling high-speed networking chips. 2. **Embedded Systems:** Industrial PCs where airflow is constrained. 3. **Power Electronics:** Dissipating heat from voltage regulators and power modules. --- ### 4. Thermal Resistance Data The efficiency of this part varies based on the airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 1.15 | | 200 | 1.0 | 0.82 | | 400 | 2.0 | 0.60 | ---