ATS-06G-67-C2-R0
AI

The **ATS-06G-67-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to Printed Circuit Boards (PCBs).
### 1. Key Technical Specifications
| Parameter | Details |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Base Part Number** | ATS-06G-67-C2-R0 |
| **Material** | Aluminum (Blue Anodized Finish) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Fin Type** | Straight Fin |
| **Dimensions** | 45mm x 45mm x 10mm (L x W x H) |
| **Thermal Resistance** | ~20.30°C/W (Unducted Flow @ 200 LFM) |
---
### 2. Detailed Part Breakdown
#### A. The Heat Sink Body
The main body is constructed from aluminum. The **blue anodized finish** is not just for aesthetics; it provides surface protection against corrosion and slightly improves thermal emissivity compared to raw aluminum.
#### B. Attachment Mechanism (Push-Pin)
Unlike adhesive-based heat sinks, this model uses a mechanical **Push-Pin and Spring** system.
* **Benefits:** Provides consistent pressure on the component (CPU, FPGA, or GPU), which optimizes thermal interface material (TIM) performance.
* **Reliability:** It is more secure than tape in high-vibration environments.
#### C. Thermal Performance
The "Straight Fin" design is optimized for environments where there is a consistent directional airflow (forced convection). The low profile (10mm height) makes it ideal for 1U servers or slim electronic enclosures.
---
### 3. Application Use Cases
This specific part is typically found in the following electronic systems:
* **Telecommunications:** Cooling of high-speed networking chips.
* **Embedded Systems:** Industrial PCs where mechanical stability is required.
* **Power Supplies:** Heat dissipation for MOSFETs or power regulators.
---
### 4. Thermal Resistance Reference
Below is a simplified representation of how air velocity affects its performance:
```text
Air Velocity (LFM) | Thermal Resistance (°C/W)
-------------------|--------------------------
200 (1.0 m/s) | 20.30
400 (2.0 m/s) | 11.50
600 (3.0 m/s) | 8.50
```
- ⤷
What is the hole pattern required on the PCB for this heat sink?
- ⤷ Which Thermal Interface Material (TIM) is recommended for use with the ATS-06G series?
- ⤷ Is there a version of this heat sink with a higher profile for better cooling?