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  • ATS-06G-67-C2-R0

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    The **ATS-06G-67-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to Printed Circuit Boards (PCBs). ### 1. Key Technical Specifications | Parameter | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Part Number** | ATS-06G-67-C2-R0 | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Type** | Straight Fin | | **Dimensions** | 45mm x 45mm x 10mm (L x W x H) | | **Thermal Resistance** | ~20.30°C/W (Unducted Flow @ 200 LFM) | --- ### 2. Detailed Part Breakdown #### A. The Heat Sink Body The main body is constructed from aluminum. The **blue anodized finish** is not just for aesthetics; it provides surface protection against corrosion and slightly improves thermal emissivity compared to raw aluminum. #### B. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, this model uses a mechanical **Push-Pin and Spring** system. * **Benefits:** Provides consistent pressure on the component (CPU, FPGA, or GPU), which optimizes thermal interface material (TIM) performance. * **Reliability:** It is more secure than tape in high-vibration environments. #### C. Thermal Performance The "Straight Fin" design is optimized for environments where there is a consistent directional airflow (forced convection). The low profile (10mm height) makes it ideal for 1U servers or slim electronic enclosures. --- ### 3. Application Use Cases This specific part is typically found in the following electronic systems: * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Systems:** Industrial PCs where mechanical stability is required. * **Power Supplies:** Heat dissipation for MOSFETs or power regulators. --- ### 4. Thermal Resistance Reference Below is a simplified representation of how air velocity affects its performance: ```text Air Velocity (LFM) | Thermal Resistance (°C/W) -------------------|-------------------------- 200 (1.0 m/s) | 20.30 400 (2.0 m/s) | 11.50 600 (3.0 m/s) | 8.50 ```
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern required on the PCB for this heat sink?
    • ⤷ Which Thermal Interface Material (TIM) is recommended for use with the ATS-06G series?
    • ⤷ Is there a version of this heat sink with a higher profile for better cooling?