ATS-06G-70-C2-R0
AI

The **ATS-06G-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) like processors, FPGAs, and ASICs.
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### 1. Technical Specifications
The part number contains specific encoded data regarding its dimensions and material properties:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 8.70 °C/W (Unducted @ 100 LFM) |
| **Base Dimensions** | 45mm x 45mm |
| **Height** | 25mm |
| **Pitch** | Fine Pitch |
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### 2. Physical Design Details
The device is engineered for maximum surface area while maintaining a compact footprint on the PCB.
* **Fin Pattern:** It utilizes a high-density fin structure to increase the surface area available for heat dissipation.
* **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766**, a high-performance thermal grease, ensuring low thermal resistance between the component and the heat sink.
* **Compression Springs:** The pushPIN™ mechanism uses stainless steel or brass springs to provide a specific, consistent pressure (preload) onto the component, preventing air gaps.
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### 3. Electronic Application
This part is used in electronics to prevent **Thermal Throttling** or hardware failure.
* **Heat Dissipation:** It absorbs heat from the silicon die via conduction and releases it into the surrounding air via convection.
* **Compatibility:** Designed for PCB holes with a specific diameter (usually 3.175mm) to accommodate the push-pins.
* **Airflow Direction:** The "G" in the part number often indicates a specific fin orientation optimized for vertical or horizontal airflow depending on the system chassis design.
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### 4. Part Number Breakdown
The nomenclature can be decoded as follows:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **06:** Series/Type.
* **G:** Fin pattern/Profile.
* **70:** Dimensions code.
* **C2:** Thermal performance/TIM type.
* **R0:** RoHS Compliance/Revision status.
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What are the mechanical mounting requirements for pushPIN heat sinks?
- ⤷ How does the T766 thermal interface material compare to standard thermal pads?
- ⤷ Can this heat sink be used in fanless/passive cooling environments?