The **ATS-06G-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to maximize airflow and heat dissipation in constrained electronic environments. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Product Series** | maxiFLOW™ | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Thermal Resistance** | 7.03°C/W (at 200 LFM) | | **Finish** | Blue Anodized | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Key Features and Components #### A. The maxiFLOW™ Design The heat sink features a unique **flared fin structure**. Unlike standard straight fins, these fins expand outward. This design: * Reduces pressure drop across the heat sink. * Increases the effective surface area for heat exchange. * Optimizes airflow from cooling fans. #### B. pushPIN™ Attachment System The "R0" suffix indicates the inclusion of the **pushPIN™** mounting system. This consists of: * **Brass or Plastic Pins:** Designed to fit into pre-drilled holes on the PCB. * **Compression Springs:** Provide precise, consistent pressure (clamping force) onto the electronic component (CPU, GPU, or ASIC). This ensures optimal contact with the Thermal Interface Material (TIM). #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance thermal grease/pad that fills microscopic air gaps between the component and the heat sink, significantly lowering thermal resistance. --- ### 3. Application Use Cases This part is typically used in the following electronic assemblies: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Cooling MOSFETs or small power modules. 4. **Network Storage:** NAS devices where airflow might be restricted. --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **06:** Series Identifier * **G:** Fin Geometry/Pitch * **80:** Specific Dimension/Height Code * **C2:** Material/Finish (Blue Anodized) * **R0:** Revision/Mounting Kit type