The **ATS-06G-82-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The part number encodes specific data regarding its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 10.79°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 25mm | | **Fin Pattern** | Straight Fin | --- ### 2. Key Electronic Functions While the heat sink itself is passive, its electronic "parts" or features are critical for system stability: * **Thermal Interface Material (TIM):** This part comes pre-applied with **T766 phase-change material**. Its job is to fill microscopic air gaps between the electronic component (die) and the heat sink base to maximize heat transfer. * **Mechanical Attachment:** It utilizes a **Push-pin and Brass Spring** mechanism. This ensures a consistent, calculated downward force (pressure) on the electronic chip, which prevents the sink from shifting during vibration or thermal expansion. * **Heat Dissipation:** The straight fin design is optimized for **forced air cooling** (active airflow from a fan). By increasing the surface area of the electronic assembly, it prevents "Thermal Throttling" or hardware failure due to overheating. --- ### 3. Application Use-Cases This specific heat sink is typically found in the following electronic environments: 1. **Telecommunications:** Cooling small processors in routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but height (25mm) is available. 3. **Power Supplies:** Cooling voltage regulators or MOSFETs that generate significant heat in a 30x30mm footprint. ---