The part number **ATS-06G-84-C2-R0** refers to a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). This component is part of their "push pin" attachment series, designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number itself follows a specific nomenclature that defines its physical and thermal characteristics. | Specification | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | Approx. 7.00°C/W (at 100 LFM) | | **Dimensions** | 30mm x 30mm x 25mm | | **Fin Style** | Straight Fin | --- ### 2. Physical Design Features This heat sink is engineered for specific airflow environments and mounting security: * **Straight Fin Design:** Optimized for "longitudinal" airflow. The fins are aligned to allow air to pass straight through, making it ideal for systems with clear intake-to-exhaust paths. * **Push-Pin Mounting:** Unlike adhesive tapes, the push-pin mechanism uses a pre-drilled hole in the PCB and a spring-loaded pin. This provides: * **Consistent Pressure:** Ensures the thermal interface material (TIM) is compressed evenly. * **Reliability:** Better vibration resistance compared to clip-on or adhesive mounts. * **Material (Aluminum):** Provides a balance between thermal conductivity and lightweight construction, preventing excessive mechanical stress on the PCB. --- ### 3. Thermal Performance Profile The efficiency of the **ATS-06G-84-C2-R0** depends heavily on the velocity of the air moving through the system (measured in Linear Feet per Minute - LFM). | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Natural/Low)** | 7.00 | | **200 (Medium)** | 3.42 | | **300 (High)** | 2.62 | | **400 (Ultra)** | 2.21 | --- ### 4. Implementation Details When using this part in a design, engineers must consider the following: * **Thermal Interface Material (TIM):** This part usually comes with **T766** (a high-performance thermal phase change material) or similar pre-applied to the base. * **Hole Pattern:** The PCB must have specific hole diameters and spacing to accommodate the push pins. * **Clearance:** The 25mm height must be checked against the enclosure dimensions to ensure there is no mechanical interference.