The **ATS-06H-151-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blueICE" series, specifically designed for cooling electronic components like CPUs, GPUs, and high-power MOSFETs. --- ### 1. Key Technical Specifications | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | blueICE | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 3.93°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 30.00mm | --- ### 2. Physical Design and Construction * **Fins:** It features a **Straight Fin** design. This is optimized for airflow that is directed linearly across the heat sink. * **Base Material:** Made from lightweight aluminum which provides high thermal conductivity while remaining cost-effective. * **The "C2" Suffix:** This indicates the thermal interface material (TIM) or specific finish. In this case, it typically refers to **T766** (a high-performance thermal phase-change material) pre-applied to the base. * **The "R0" Suffix:** This usually denotes the RoHS (Restriction of Hazardous Substances) compliance version of the product. --- ### 3. Attachment Mechanism: pushPIN™ The most notable electronic/mechanical feature of this part is the **pushPIN™** system. 1. **Mounting:** It utilizes plastic or brass pins with a built-in spring. 2. **Pressure:** The spring provides precise, constant pressure on the electronic component, ensuring optimal thermal contact. 3. **Ease of Use:** It is designed for quick assembly on PCBs (Printed Circuit Boards) with pre-drilled holes, eliminating the need for messy adhesives or complicated bracket systems. --- ### 4. Thermal Performance Data Performance varies based on the airflow (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | |:---|:---| | 100 (0.5 m/s) | 3.93 | | 300 (1.5 m/s) | 2.05 | | 500 (2.5 m/s) | 1.63 | --- ### 5. Application Usage This heat sink is commonly used on: * **ASICs and FPGAs:** High-density chips requiring stable thermal management. * **Power Supplies:** Cooling voltage regulators. * **Telecom Equipment:** Used in rack-mounted servers where directional airflow is consistent.