The **ATS-06H-33-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Fin Type** | Straight Fin | | **Base Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin | | **Dimensions (L x W x H)** | 57.90mm x 36.83mm x 17.78mm | | **Thermal Resistance** | 1.40 °C/W (at 200 LFM) | --- ### 2. Breakdown of Features #### A. The "pushPIN™" Attachment Unlike heat sinks that use adhesive tape or clips, this model uses a **Push-Pin** system. This provides: * **Constant Pressure:** Ensures optimal contact between the heat sink and the component for better heat transfer. * **Secure Mounting:** Uses a spring-loaded mechanism that snaps into pre-drilled holes on the PCB. #### B. Straight Fin Design The "33" in the part number corresponds to a specific fin profile. Straight fins are ideal for **unidirectional airflow** (forced convection). The aluminum construction provides a balance between weight and thermal conductivity. #### C. Thermal Performance Thermal resistance is measured in °C/W (Degrees Celsius per Watt). A lower number means better cooling. * **Unducted Flow:** 17.42 °C/W (at 100 LFM) * **Ducted Flow:** 1.40 °C/W (at 200 LFM) --- ### 3. Dimensional Drawing (Simplified Representation) ```text <--- 57.90mm ---> _____________________ ^ | ||||||||||||||||||| | | | ||||||||||||||||||| | 36.83mm |_____________________| v Height (Profile): 17.78mm ``` --- ### 4. Typical Applications * **Embedded Systems:** Cooling microprocessors in industrial PCs. * **Telecommunications:** Cooling ASICs in networking switches or routers. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.