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  • ATS-06H-35-C2-R0

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    The **ATS-06H-35-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and physical characteristics. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance (Natural Flow)** | 12.83°C/W @ 0 LFM | | **Thermal Resistance (High Flow)** | 1.57°C/W @ 700 LFM | --- ### 2. Physical Dimensions Precision is critical for PCB layout and component clearance. The dimensions are as follows: * **Length (A):** 35.00 mm * **Width (B):** 35.00 mm * **Height (C):** 10.00 mm (Low profile) * **Pitch (E):** 40.00 mm (Distance between mounting holes) * **Pitch (F):** 40.00 mm --- ### 3. Key Features and Design #### A. Fin Design (Straight Fin) This model uses a **Straight Fin** pattern. This design is optimized for environments with a consistent direction of airflow. The fins increase the surface area available for heat dissipation into the surrounding air. #### B. pushPIN™ Attachment System The part number suffix indicates the use of the ATS pushPIN™ system. This includes: * A pre-drilled hole pattern. * A compression spring to provide uniform pressure across the thermal interface. * Improved reliability compared to basic adhesive tapes. #### C. Thermal Interface Material (TIM) The **"C2"** in the part number typically denotes that the heatsink comes pre-applied with **T766 phase change material** or a high-performance thermal grease. This ensures low thermal resistance between the component die and the aluminum base. --- ### 4. Applications * **Networking:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and high-speed processors where vertical clearance is limited (10mm height). ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between the C2 and C1 versions of this heatsink?
    • ⤷ How do I calculate the required airflow (LFM) for my specific chip wattage?
    • ⤷ Are there 3D CAD models available for the ATS-06H series?