ATS-06H-35-C2-R0
AI

The **ATS-06H-35-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components.
Below is a detailed breakdown of its specifications and physical characteristics.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Thermal Resistance (Natural Flow)** | 12.83°C/W @ 0 LFM |
| **Thermal Resistance (High Flow)** | 1.57°C/W @ 700 LFM |
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### 2. Physical Dimensions
Precision is critical for PCB layout and component clearance. The dimensions are as follows:
* **Length (A):** 35.00 mm
* **Width (B):** 35.00 mm
* **Height (C):** 10.00 mm (Low profile)
* **Pitch (E):** 40.00 mm (Distance between mounting holes)
* **Pitch (F):** 40.00 mm
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### 3. Key Features and Design
#### A. Fin Design (Straight Fin)
This model uses a **Straight Fin** pattern. This design is optimized for environments with a consistent direction of airflow. The fins increase the surface area available for heat dissipation into the surrounding air.
#### B. pushPIN™ Attachment System
The part number suffix indicates the use of the ATS pushPIN™ system. This includes:
* A pre-drilled hole pattern.
* A compression spring to provide uniform pressure across the thermal interface.
* Improved reliability compared to basic adhesive tapes.
#### C. Thermal Interface Material (TIM)
The **"C2"** in the part number typically denotes that the heatsink comes pre-applied with **T766 phase change material** or a high-performance thermal grease. This ensures low thermal resistance between the component die and the aluminum base.
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### 4. Applications
* **Networking:** Routers, switches, and base stations.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Electronics:** Voltage regulators and high-speed processors where vertical clearance is limited (10mm height).
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- ⤷
What is the difference between the C2 and C1 versions of this heatsink?
- ⤷ How do I calculate the required airflow (LFM) for my specific chip wattage?
- ⤷ Are there 3D CAD models available for the ATS-06H series?