The **ATS-06H-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance (Unducted)** | 14.56 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Fin Style** | Fine Pitch (Straight Fin) | --- ### 2. Key Electronic & Mechanical Components #### A. Fin Design This model uses a **Straight Fin** profile. In electronics, the fins increase the surface area available for heat exchange with the surrounding air. The "Fine Pitch" design is optimized for high-airflow environments (active cooling). #### B. The pushPIN™ Attachment System The "06H" designation refers to the specific attachment mechanism. This electronic part utilizes a spring-loaded push-pin system which provides: * **Constant Pressure:** Ensures a tight interface between the heat sink base and the electronic chip. * **Vibration Resistance:** Securely holds the component in place during mechanical stress. * **Ease of Assembly:** Can be installed manually or via automated assembly lines. #### C. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the part comes pre-applied with a **T766 Phase Change Material**. This is an electronic grade TIM that fills microscopic air gaps between the heat sink and the semiconductor, significantly lowering thermal resistance. --- ### 3. Application Use Cases This part is commonly found in the following electronic sectors: * **Telecommunications:** Cooling for high-speed routers and switches. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. * **Embedded Systems:** Thermal management for industrial PC processors. ---