ATS-06H-92-C2-R0
AI

The **ATS-06H-92-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components like CPUs, GPUs, or power transistors.
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## Technical Specifications
The following table outlines the key physical and thermal characteristics of the device:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. |
| **Series** | pushPIN™ HS |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm |
| **Thermal Resistance** | 1.64°C/W (at 100 LFM) |
| **Fin Style** | Straight Fin |
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## Component Breakdown
### 1. Thermal Performance
The "C2" in the part number indicates a specific thermal interface material (TIM) or performance grade. This heat sink is designed to dissipate heat effectively in a "forced air" environment (where a fan is present). At higher airflow speeds (e.g., 500 LFM), the thermal resistance drops significantly, allowing the electronic component to run cooler.
### 2. Attachment System (pushPIN™)
Unlike adhesive-based heat sinks, this model uses a **push-pin and spring** mechanism.
* **Reliability:** Provides consistent pressure for better thermal contact.
* **Ease of Use:** Allows for quick installation and removal without messy glues.
* **Stability:** Specifically designed to withstand vibration and mechanical shock.
### 3. Material and Coating
* **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio.
* **Blue Anodized Finish:** This is not just for aesthetics; the anodization process increases the surface area at a microscopic level and protects the aluminum from corrosion.
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## Common Applications
* **Embedded Systems:** Cooling microprocessors on industrial motherboards.
* **Telecommunications:** Managing heat in networking switches and routers.
* **Power Electronics:** Dissipating heat from high-voltage regulators or FETs.
- ⤷
What are the mounting hole requirements for the push-pin system?
- ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
- ⤷ Is there a version of this heat sink with a different height or fin type?