The **ATS-07A-01-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits. --- ### 1. Technical Specifications Below are the primary physical and thermal properties of the part: | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Thermal Resistance** | 21.93 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 6mm | | **Fin Type** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Electronic Component Breakdown #### A. Fin Geometry (Straight Fin) The "01" in the part number refers to the straight fin profile. This design is optimized for **forced air cooling** environments. The spacing between the fins allows for low pressure drop, making it suitable for systems where airflow is directed across the component by a fan. #### B. Thermal Interface Material (TIM) The **C2** designation indicates that the heat sink comes with **T766 thermal phase change material** pre-applied to the base. - This material flows into the microscopic irregularities between the heat source (the chip) and the heat sink base when heated. - It significantly reduces the contact thermal resistance compared to air. #### C. Mounting Mechanism (Push Pins) The **R0** suffix indicates the specific revision and mounting hardware kit. - It utilizes **plastic push pins** with a brass spring. - This mechanism provides consistent pressure (load) on the electronic component, ensuring maximum heat transfer without damaging the delicate silicon die. --- ### 3. Application Use Cases This specific heat sink is typically used for low-profile applications due to its **6mm height**: 1. **Embedded Systems:** For cooling processors in space-constrained enclosures. 2. **Network Switches:** Cooling ASICs and controllers. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. ---