ATS-07A-10-C2-R0
AI

The **ATS-07A-10-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. This component belongs to their "push pin" series, designed for cooling integrated circuits (ICs) and other electronic components.
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### 1. Technical Specifications
Below is a breakdown of the physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Dimensions (L x W x H)** | 45mm x 45mm x 25mm |
| **Thermal Resistance** | 7.89°C/W (Unducted Flow @ 200 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Component Analysis
This electronic part consists of three primary sub-elements that work together to manage heat:
#### A. The Heat Sink Body (Finned Structure)
The "10-C2" designation refers to the fin pattern and height. It uses a **Straight Fin** design, which is optimized for airflow directed through the fins. The aluminum body is blue anodized to prevent corrosion and slightly increase surface emissivity.
#### B. The Push-Pin & Spring Mechanism
Unlike adhesive-based heat sinks, the **ATS-07A-10-C2-R0** uses a mechanical attachment:
* **Reliability:** Provides constant pressure (preload) on the chip, ensuring a better thermal connection over time.
* **Installation:** Requires pre-drilled holes in the PCB (Printed Circuit Board).
#### C. Thermal Interface Material (T766)
The "R0" at the end of the part number indicates it comes with a pre-applied **T766 phase-change material**. This eliminates the need for manual application of thermal paste and ensures air gaps between the chip and the heat sink are filled.
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### 3. Common Applications
This part is typically used in the following electronic environments:
* **Networking Gear:** Switches and routers where high-speed processors generate significant heat.
* **Embedded Systems:** Industrial PCs or controllers.
* **Power Supplies:** Cooling MOSFETs or voltage regulators.
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- ⤷
What are the PCB hole requirements for the push-pin mounting of this heat sink?
- ⤷ How does the thermal resistance change at different airflow (LFM) rates?
- ⤷ Are there alternative versions of this part with different thermal interface materials?