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  • ATS-07A-10-C2-R0

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    The **ATS-07A-10-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. This component belongs to their "push pin" series, designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 7.89°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Component Analysis This electronic part consists of three primary sub-elements that work together to manage heat: #### A. The Heat Sink Body (Finned Structure) The "10-C2" designation refers to the fin pattern and height. It uses a **Straight Fin** design, which is optimized for airflow directed through the fins. The aluminum body is blue anodized to prevent corrosion and slightly increase surface emissivity. #### B. The Push-Pin & Spring Mechanism Unlike adhesive-based heat sinks, the **ATS-07A-10-C2-R0** uses a mechanical attachment: * **Reliability:** Provides constant pressure (preload) on the chip, ensuring a better thermal connection over time. * **Installation:** Requires pre-drilled holes in the PCB (Printed Circuit Board). #### C. Thermal Interface Material (T766) The "R0" at the end of the part number indicates it comes with a pre-applied **T766 phase-change material**. This eliminates the need for manual application of thermal paste and ensures air gaps between the chip and the heat sink are filled. --- ### 3. Common Applications This part is typically used in the following electronic environments: * **Networking Gear:** Switches and routers where high-speed processors generate significant heat. * **Embedded Systems:** Industrial PCs or controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push-pin mounting of this heat sink?
    • ⤷ How does the thermal resistance change at different airflow (LFM) rates?
    • ⤷ Are there alternative versions of this part with different thermal interface materials?